ASE expects advanced packaging business to double by 2026, reaching $3.2 billion
Special Topic: Focus on U.S. Stock Q4 2025 Earnings Reports
The world's largest chip packaging and testing company, ASE Technology Holding, stated on Thursday that it expects its advanced packaging business to double in scale by 2026, reaching $3.2 billion.
This statement was made by ASE’s Chief Operating Officer, Tien Wu, during the quarterly earnings call. The financial report shows that the company’s Q4 revenue reached TWD 177.9 billion (approximately $5.62 billion), a year-on-year increase of 9.6%; net profit soared 58% year-on-year.
ASE’s subsidiary, Siliconware Precision Industries (SPIL), is a core packaging supplier for Nvidia’s AI chips.
Chief Financial Officer Joseph Tung stated that the company plans to increase this year’s equipment capital expenditure by an additional $1.5 billion on top of last year’s $3.4 billion; meanwhile, investment in plants and facilities is expected to remain at a similar level to last year’s $2.1 billion.
Joseph Tung said: “We will continue to increase capital expenditure to support the strong business outlook for 2026 and beyond.”
Editor: Guo Mingyu
Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.
You may also like

The 5% U.S. Treasury yield storm is coming! The refinancing time bomb countdown begins—who will be the first victim?
The 10-year US Treasury yield has surpassed 5%, reaching a new high since 2007. The longer high interest rates persist, the greater the refinancing pressure will be on real estate companies, commercial real estate, and highly indebted firms, with systemic risks likely to accelerate and emerge within the next 12 to 18 months.

Don't Fight the Profit Cycle! Will U.S. Stocks Break 8,000 Points This Year?
Jefferies predicts that, driven by the dual engines of the AI investment boom and stronger-than-expected corporate earnings, the S&P 500 index is expected to soar to 8,000 points by the end of 2026 and further reach 9,000 points in 2027. AI-driven profit expansion has spread from the "Magnificent Seven" to the entire market, with the S&P 500's EPS forecast to surge by 35% this year, far exceeding market consensus—marking the strongest earnings supercycle since 1995! The only real threat: if US Treasury yields continue to spike, the risk of valuation compression cannot be ignored.
Will “continual learning” AI extend the memory “shortage” until 2031?
Citi believes that as AI enters the era of "continuous learning" beyond simple training and inference stages, demand for HBM, server DDR5, and enterprise SSDs (eSSD) will experience explosive and simultaneous growth starting from 2027. While demand will surge rapidly, the supply side is constrained by HBM production capacity usage and slower technology migration, leading to expansion lagging far behind demand. This supply-demand imbalance is expected to continue until 2031.
