Intel expands EMIB packaging capacity and advances large-scale materials, components, and equipment procurement orders
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Glonghui May 29|According to ETNews, Intel is making large-scale investments in advanced semiconductor packaging to accelerate the revival of its foundry business. Industry sources reported on the 28th that Intel is currently issuing extensive procurement orders for “materials, components, and equipment” to global supply chain partners, with several supply contracts already signed. An industry insider familiar with the matter stated, “The current investment scale in advanced packaging equipment has reached several trillion KRW.” This investment is primarily focused on expanding the production capacity of “EMIB (Embedded Multi-die Interconnect Bridge).” Intel is also advancing EMIB technology upgrades, including “EMIB-T,” which incorporates Through-Silicon Via (TSV) technology in the bridging structure, as well as package solutions that integrate glass substrates.
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