It is reported that TSMC has released a glass substrate development plan to its supply chain, revealing its technical progress for the first time.

Golden Ten Data reported on June 16 that, according to equipment sources, TSMC has recently launched a "CoWoS Glass Substrate Development Plan" to its supply chain, confirming collaboration with ABF substrate supplier Ibiden and panel manufacturer Innolux to jointly verify the feasibility of introducing glass substrates into CoWoS advanced packaging. This marks TSMC's first public disclosure of its glass substrate technology application process, signifying that glass substrates have officially entered the stage of industrialization verification. However, full-scale mass production of glass substrates is still some way off. TSMC emphasized that ongoing research and verification are needed regarding glass thickness and large-scale CoWoS packaging layouts in the future.