TSMC partners with Winbond to supply DRAM wafers

Winbond will provide DRAM and other memory wafers, which will be vertically stacked together with TSMC logic process wafers. Previously, the memory wafers required for TSMC's WoW technology mainly depended on three international manufacturers from a certain exchange. Related articles: TSMC joins hands with Winbond to supply DRAM wafers, no longer relying solely on a certain exchange.