Samsung Electronics announces 2nm technology and AI semiconductor ecosystem collaboration plan

According to Odaily, Samsung Electronics held the SAFE Forum 2026 in Seoul, announcing the next-generation 2nm process, DTCO (Design Technology Co-Optimization), a high-performance SRAM roadmap, and put forward strategies to expand cooperation within South Korea’s AI semiconductor ecosystem and next-generation wafer foundry technology. Samsung Electronics stated that it will strengthen communication with customers and partners through the SAFE Forum and reinforce its platform role within South Korea’s system semiconductor industry beyond wafer foundry production. South Korean AI fabless company Rebellions said it has developed the REBEL100 NPU based on Samsung Electronics’ 4nm foundry process and advanced packaging, and will continue cooperation in the AI semiconductor field moving forward. Samsung Electronics also participates in the M.AX alliance, promoted by the Ministry of Trade, Industry and Energy, driving the development of low-power, high-performance edge AI semiconductors for automotive, home appliances, robotics, and defense sectors. The company will also continue supporting the MPW project, which reduces the burden of initial sample production for South Korean fabless companies, and the K-CHIPS talent development program.