ASE increases advanced packaging prices, with hikes up to 20%

```htmlGlonhui July 1｜According to MoneyDJ, the world's leading outsourced semiconductor assembly and test (OSAT) supplier ASE has once again adjusted packaging prices, with the maximum price increase exceeding 20%. This round of price hikes covers various advanced packaging technologies, including wafer substrate chip packaging (CoWoS) and fan-out substrate chip packaging (FoCoS), and ASE's major clients in the United States are also affected. ASE CEO T.Y. Wu stated that the price increases primarily reflect rises in raw material prices, and such price hikes are necessary; secondly, they also reflect increased capital expenditures, considering the investment costs.```