Korean media: Samsung Electronics and SK Hynix may delay the adoption of next-generation HBM hybrid bonding technology
According to Odaily, South Korean media report that Samsung Electronics and SK Hynix are re-evaluating the timeline for adopting hybrid bonding technology in the next generation of high-bandwidth memory (HBM). As the demand for further thickness reduction and improved thermal performance in HBM has decreased, the market now expects the introduction of this technology may be postponed even further compared to previous projections. At the same time, both companies are developing new cooling solutions such as HPB and iHBM, which they plan to apply to their HBM5 products. However, industry insiders believe that as the number of HBM I/O channels continues to increase in the future, hybrid bonding will remain an important mid- to long-term technological direction.
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