Samsung and SK Hynix delay the adoption of hybrid bonding packaging technology as the industry's urgency has greatly diminished

Glonhui July 9th｜According to market sources, Samsung Electronics and SK Hynix originally planned to use hybrid bonding technology for HBM4, but are currently reconsidering. Hybrid bonding is an advanced semiconductor packaging technology, and the industry expects it to be first used for 16-layer HBM4E. The two companies have reportedly decided to continue using traditional thermocompression bonding technology due to the industry's relaxation of HBM thickness standards and delayed adjustments to customer high-stacking requirements.