Samsung Electronics plans to build a new DRAM factory in Giheung with a projected monthly capacity of 100,000 wafers.

Odaily reported that Citrini analyst jukan posted on X that Samsung Electronics plans to build a new DRAM wafer plant in its Giheung campus, converting a site originally intended for an R&D center into a memory production facility. The facility is expected to have a monthly capacity of about 100,000 wafers, with a total investment anticipated to reach several tens of trillion won. Samsung Electronics has established an internal team to advance the construction of the new wafer plant, with initial groundwork possibly starting as early as the third quarter. Counterpoint Research predicts that, driven by rising product prices, global DRAM market revenue will increase from $150 billion this year to as much as $210 billion. Samsung Electronics is also installing a new production line with a monthly capacity of 100,000 wafers at its Pyeongtaek P4 factory, capable of producing DRAM used in sixth-generation HBM, namely HBM4, and plans to build a wafer plant in the next-generation semiconductor cluster in Yongin, Gyeonggi Province, with the goal of starting preliminary production by 2029. In addition, the company is pursuing the construction of two advanced semiconductor wafer plants in the Gwangju semiconductor cluster in South Jeolla Province, with a total investment of 400 trillion won.