AMD and Samsung are close to finalizing a large-scale HBM4 supply contract, with Helios expected to begin shipments by the end of the third quarter

BlockBeats news, on July 24, according to Seoul Economic Daily, AMD CEO Lisa Su stated that negotiations for a formal contract with Samsung Electronics for large-scale HBM4 supply are "nearing completion." In March this year, the two parties signed a memorandum of cooperation, which includes Samsung prioritizing supply of HBM4 to AMD’s next-generation AI accelerators, and advancing wafer foundry collaboration.

Lisa Su announced at the "AMD Advancing AI 2026" event that the AI server rack system Helios has entered full-scale mass production and is expected to start shipping from the end of the third quarter. With the launch of Helios, AMD is discussing specific contracts to further expand HBM4 supply with Samsung.

Han Jin-man, head of Samsung Electronics' wafer foundry business, and Cho Sang-yeon, head of semiconductor business in the Americas, attended the event. After the speeches, they continued discussions with AMD CTO Joseph Macri and other executives. The two Samsung executives stated that an important meeting will be held soon, but did not specifically respond to questions about further HBM4 supply contracts.

When asked about further HBM supply and the possibility of AMD chips being manufactured by Samsung, Macri only said that both parties maintain a "collaborative relationship."