Samsung Electronics and Broadcom have signed a memorandum of understanding covering cooperation in the fields of memory chips, foundry services, and advanced packaging, with cooperation amounts up to $200 billions through 2030. Samsung Electronics will work with Broadcom to develop Broadcom's next-generation AI accelerator based on Samsung HBM technology. Samsung Electronics will provide sub-2nm foundry processes and advanced packaging solutions.

Samsung Electronics and Broadcom have signed a memorandum of understanding covering cooperation in the fields of memory chips, foundry services, and advanced packaging, with cooperation amounts up to $200 billions through 2030. Samsung Electronics will work with Broadcom to develop Broadcom's next-generation AI accelerator based on Samsung HBM technology. Samsung Electronics will provide sub-2nm foundry processes and advanced packaging solutions.

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Samsung Electronics and Broadcom have signed a memorandum of understanding covering up to $200 billion in cooperation in the fields of memory chips, foundry services, and advanced packaging through 2030. Samsung Electronics will collaborate with Broadcom to develop Broadcom's next-generation artificial intelligence accelerator based on Samsung's HBM technology. Samsung Electronics will provide sub-2nm foundry processes and advanced packaging solutions.

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