Wedbush: MediaTek’s EMIB yield comments “fully confirm” Google TPU packaging orders shifting to Intel

Zhihu Finance APP has learned that Intel’s (INTC.US) advanced packaging technology is reaching a critical turning point. MediaTek clearly stated at last week’s analyst meeting that Intel’s EMIB (Embedded Multi-Die Interconnect Bridge) advanced packaging technology yield “has reached a very good level.” This statement quickly attracted significant attention on Wall Street—Wedbush analysts noted that MediaTek’s comments “further validate Intel’s progress in the packaging field,” and may suggest that Google’s (GOOGL.US) TPU orders are close at hand.