SK hynix invests over $4 billion in Indiana HBM advanced packaging plant
Reuters2026/08/27 16:26- SK hynix broke ground on an advanced packaging plant in Indiana to support next-generation HBM for AI.
- Total investment expected to exceed USD 4 billion; cleanroom targeted for October 2028.
- Mass production slated for H2 2029, marking its first “Made in USA” next-generation HBM output.
- Korea-made wafers will be shipped to Indiana for packaging, testing, then supplied to U.S. customers.
- Project includes an on-site R&D testbed; buildout aims to support about 7,000 jobs during construction and operations.
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