ULVAC to present poster on aluminum nitride thin-film heat spreader process at ADMETA2026
Bitget2026/09/25 01:23- Ulvac will present a poster at ADMETA2026 in Tokyo on Oct. 7-9, 2026.
- The poster session is scheduled for Oct. 8, 2026, 18:30-20:00 at the University of Tokyo’s Takeda Hall.
- Topic: a PVD aluminum nitride thin-film deposition process for heat spreader applications, targeting high thermal conductivity with controlled film stress.
Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.
You may also like
Raphael Zagury: Bitcoin will eventually surpass gold
Federal Reserve Bowman: AI Brings Both Opportunities and Risks to the Banking Industry, Fed Urges Strengthening of System Security Protections
Federal Reserve Vice Chair for Supervision, Bowman, warned that AI has a dual impact on the banking industry, serving both as a defensive tool and introducing new emerging risks. She urged banks to strengthen basic cybersecurity measures, including updating asset inventories, deploying multi-factor authentication, and improving vulnerability management. Bowman also stated that regulators will continue to adjust their examination approaches, implementing differentiated supervision for community banks instead of imposing blanket mandatory requirements.
FingerMotion to Buy Newbit Technology for $2.3 Million
BUZZ - Pyxis Oncology shares decline after launching equity financing