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甲骨文、博通、SpaceX爲AI晶片尋求債務融資

甲骨文、博通、SpaceX爲AI晶片尋求債務融資

智通财经智通财经2026/10/07 21:31
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According to The Wall Street Journal, Oracle, Broadcom, and SpaceX are seeking to reach debt agreements for AI chips. Broadcom is attempting to arrange over $50 billions in funding for chips required by OpenAI. Oracle is in negotiations with Apollo and Goldman Sachs regarding chip financing. Recently, the Financial Times reported that SpaceX is seeking $40 billions in financing to purchase Nvidia chips. SpaceX plans to raise about $10 billions in bank loans, plus $30 billions in investment-grade bonds.

據《華爾街日報》報導,甲骨文、博通、SpaceX正在為AI晶片尋求達成債務協議。博通正設法為OpenAI所需的晶片安排超過500億美元資金。甲骨文正與Apollo、高盛洽談晶片融資事宜。近日,《金融時報》稱,SpaceX為購買NVIDIA晶片而尋求融資400億美元。SpaceX計劃籌集約100億美元銀行貸款,外加300億美元投資級債券。
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