Chip manufacturer Tower Semiconductor will invest $3 billion in Japan
According to Odaily, chip manufacturer Tower Semiconductor announced on July 14 (local time) that it will invest $3 billion to strengthen chip manufacturing in Japan, including a $1 billion grant from the Japanese government. The statement noted that the first phase will significantly increase 300mm silicon photonics device production capacity, with full-scale production expected in the fourth quarter of 2027. This phase includes upgrading the original Fab 6 plant to enable 300mm silicon photonics device production capacity and advanced packaging capabilities. The second phase will be launched in parallel with the first phase and includes building a new 300mm lithography machine manufacturing plant next to the Fab 7 facility.
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