Nvidia signs a $1.5 billion chip packaging agreement with Amkor

Glonghui, July 24｜NVIDIA has signed a $1.5 billion agreement with Amkor Technology Inc. to support Amkor in upgrading its chip packaging facilities and expanding its semiconductor footprint in the United States. According to a statement released Thursday, NVIDIA will make an advance payment to Amkor as part of the agreement to help boost its production capacity in Arizona. Following the announcement, Amkor’s shares surged by about 15% in after-hours trading. The two companies stated that the cooperation will focus on developing chip packaging and testing technologies for artificial intelligence applications. Packaging is the crucial final stage in the semiconductor manufacturing process.